科技行腳 - 美加行腳

Canada
 1. Toronto E2
 4. Ottawa E1
 8. Vancouver W1
63. Victoria W1

U.S.
  1. New York E4
  2. Los Angeles W4
  3. Chicago E3
  4. Houston E5
  5. Philadelphia E4
  7. San Antonio E5
  8. San Diego W4
 10. San Jose W3
 13. San Francisco W3
 18. Detroit E3
 22. Boston E4
 23. Seattle W1 微軟 (Redmond), 波音, Starbucks
 29. Portland W2
 30. Las Vegas W4
 47. Oakland W3
 70. Buffalo E2
 90. Fremont W3
231. Berkeley W3

Great Lakes
 1. Lake Superior
 2. Lake Huron
 3. Lake Michigan (Chicago)
 4. Lake Erie (Detroit, Buffalo)
 5. Lake Ontario (Toronto)

Erie -> Niagara Falls -> Ontario

iPAD - Fast Boot

科技行腳 - 重慶成都的筆電產業

Foxconn Revenue 59.3 billion (2010)
Cisco Gross Margin 62.7 % (2010)

2010 GDP US (www.imf.org)
HK 31,514
KR 20,756
SG 43,116
TW 18,558

Cargo (www.airports.org)
長榮機隊 + 中華機隊 = World Wide No.1
 1. 香港國際 416t
 3. 上海浦東 322t
13. 台灣桃園 176t
15. 北京首都 154t

TED | Talks | Chinese Subtitle

http://www.ted.com/talks?lang=chi_hant
我現在才知道 TED 有中文字幕
而且跟英文的原版數量僅差 10% 左右.
不知道要感謝大陸人的規模還是台灣人的積極.

Itanium is Itanium, but Xeon is x86-64

The Itanium architecture is based on explicit instruction-level parallelism, in which decisions about which instructions to execute in parallel must be made by the compiler.

Dalvik

Android - Dalvik VM 主要完成 Object 的 Management of Life-cycle, Stack, Thread, Safety, Exception and Garbage Collection.

http://en.wikipedia.org/wiki/Dalvik_(software)

20 finger touch simultaneously and less than 6ms response time

3M Projected Capacitive Technology (3M PCT) is based on mutual capacitance operation theory.

Unique attributes of this technology are:

• 20-finger multi-touch input
• Less than 6ms multi-touch response time (for all 20 fingers) for applications that are speed sensitive
• Precise, accurate touch for detailed applications
• Multi-user and multi-tasking capabilities
• Compatible with Windows 7

3M PCT Multi Touch Technology has received Windows Touch Additional Qualification (AQ) for multi-touch interactivity.

Product implementations:

what is the FR4 technology?

FR4 PCB materials are made of epoxy resin that saturates woven fibreglass and as such is classed as a general grade laminate. It is suitable for both multilayer base materials and double sided materials. FR4 has the best electrical, thermal and physical characteristics compared to other laminates for many PCB applications.

南北橋的對立起始點

The chipset is typical partitioned as a memory hub and an I/O hub since the memory bus often changes with each processor generation.
[Ref. Intel Developer Network for PCI Express Architecture]

Currently by far the most popular local I/O bus, the Peripheral Component Interconnect (PCI) bus was developed by Intel and introduced in 1993. It is geared specifically to fifth- and sixth-generation systems, although the latest generation 486 motherboards use PCI as well.

不過最早的原因, 是早期顯示卡需要跟大家共用頻寬, 但是顯示難免需要吃掉太部分頻寬, 因此有兩個辦法可以解決, 一個就是提供一張擁有GPU的顯示卡, 讓顯示獨立運作. 一個就是讓顯示可以跟CPU是在同一個頻率下運作, 因此產生了CPU與Video RAM是經由Local Bus, 而非透過Expansion Bus. 但由於Local Bus各家不一, 因此在1993年, Intel提出了PCI Local Bus標準規格, 使得此事得以緩和.

What is Freescale

Freescale Semiconductor, Inc., formerly a Motorola Company, became a publicly traded company in July 2004 after more than 50 years as part of Motorola, Inc.

Intel Centrino 的命名

Centrino, 是由 Center 跟 Neutrino 兩個字所混合的.

Centrino Mobile Technology 的第一代稱 Centrino, 第二代多了代稱 Sonoma, 第三代 Napa.
主要是由三項東西所組合而成, CPU, Chipset, WLAN.
焦點集中於 Breakthrough Mobile performance, Integrated WLAN Capability, Great Bettery Lift, 及 Thinner and Lighter Designs.
為了打造 Mobile Degital Office, Mobile On-the-Go, Mobile Entertainment.

而 Pentium-M 的 CPU, 1G: Banias, 2G: Dothan, 3G: Yonah, 4G: Merom.
3G 預計2006年初上市, 4G 正在研發當中, 將會整合入 AMD 的 EM64T.

半導體材料會發光發熱

一般半導體是由 IV 族元素組成的元素半導體如 Si. Se, 或者 III, V 族 II, VI 族組成的二元化合物半導體, 當然還有可能有三元四元等化合物半導體.
若電子得到能量, e.g. 受熱. 若電子從導電帶 (Conduction Band), 直接跳回價電帶 (Valence Band), 則此時為直接復合, 能量會以光的形式釋放出來. 若電子是從低於費米能階Ef的位置Er跳至價電帶, 然後導電帶的電子再跳至該位置Er來補償, 此時該間接復合, 能量會以熱的形式釋放出來. 而矽主要是靠間接復合.

Mobile 的 3G 是什麼 ?

http://www.itu.int/osg/spu/ni/3G/technology/index.html

我在這兩個網站看CPU的歷史與演進

http://arstechnica.com
http://www.pcguide.com

First Generation - 8086.8088
Second Generation - 80286 (實際上有開發80186, 但沒有推到市場過)
Third Generation - 80386 (這時候有分DX跟SX兩種)
Fourth Generation - 80486 (這時候的DX跟SX與386那時的不同, 這裡的SX是不含 FPU)
Fifth Generation - 80586 - Pentium (Intel為了區隔市場, 而弄出的商標, P54C Micro-Architecture)
Sixth Generation - 80686 - Pentium Pro, Pentium II, Pentium III (此時有了Out-of-Order Execution, 將 Instruction 分解成 uOP, 以及一些技術都引進了, P6 Micro-Architecture)
Seventh Generation - Pentium 4 (採用 NetBurst Architecture, 用更深的 Pipeline 拉到更高的時脈運作)
??? Generation - Pentium M (Intel 在 Israel 的另外一組團隊, 在 Transmeta 開發出一個 High-Performance & Low-Power 為主的 CPU (Crusoe) 後, 投入研發得到的成果, 採用 P6 Architecture, 再加上 P4 的一些技術混合而成, 而不採用 NetBurst Architecture, 據說因此 Intel 出走了一批人)

Power.org - IBM PowerPC 集散地

Power.org - Home